At the ESU TECHNOLOGY FORUM 2019, the trade fair of the Europäische Stanzform Union e.V. (The European Diemaker Association), visitors can find out about current diecutting technology trends, products and solutions.
CITO‑SYSTEM GmbH will also be presenting its latest developments and innovations. Find out about our diemaking products and solutions: for example ejection material, counterboard material and diemaking accessories – all for the production of high-quality and efficient cutting dies. Our experts are looking forward to having interesting technical discussions with you and answering your questions. We see ourselves as your partner who supports you in your daily tasks and challenges!
The show highlights at a glance:
- High-quality ejection materials and profile rubbers such as CITOject F, CITO FAST Rubber or CITO Solid Rubber Profiles for corrugated board
- Innovative solutions such as the self-adhesive CITO EasyFix Fingerlift
- Certified materials for food packaging
- Successful solutions for creasing such as CITO ULTIMATE or AC 3
See for yourself. Come and visit us from Friday, September 13 to Saturday, September 14, 2019 at the ESU TECHNOLOGY FORUM in Luxembourg.
See you in Luxembourg!