At the ESU TECHNOLOGY FORUM 2019, the trade fair of the Europäische Stanzform Union e.V. (The European Diemaker Association), visitors can find out about current diecutting technology trends, products and solutions.
|IndiaCorrExpo||Delhi||India||05.09. – 07.09.2019|
|ESU TECHNOLOGY FORUM||Luxembourg||Luxembourg||13.09. – 14.09.2019|
|PACK PRINT INTERNATIONAL||Bangkok||Thailand||18.09. – 21.09.2019|
|FachPack||Nuremberg||Germany||24.09. – 26.09.2019|
|FEFCO Technical Seminar 2019||Geneva||Switzerland||09.10. – 11.10.2019|
|pamex||Mumbai||India||06.01. – 09.01.2020|
|drupa||Düsseldorf||Germany||16.06. – 26.06.2020|
CITO trainees proudly presented their company at the “parentum” careers information day, which took
place on 26 January 2019 in Nuremberg. The trainees were supported by former colleagues who,
after completing their training, had been given permanent positions at CITO‑SYSTEM GmbH.
Successful trade show presentation by Indutech ApS
From 23 to 26 October 2018, CITO representative Indutech ApS presented the products and innovations of CITO‑SYSTEM GmbH at the SCANPACK, Northern Europe's No. 1 trade fair for the packaging industry.
Another successful appearance of CGSASP Private Limited at the IndiaCorr Expo
The IndiaCorr Expo, which took place in Mumbai from 04 – 06/10/2018, is one of the leading trade fairs for the corrugated packaging industry in India.
Sri Lanka Print 2018, previously known as the “Collate Exhibition”, was this year upgraded to the status of a National Exhibition because of its importance to our country. It was held from 16th to 18th March 2018 in Colombo, on the theme “Going GLOBAL”. Both local and foreign exhibitors participated.